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  3. (4)植物病理組
Please use this identifier to cite or link to this item: https://scholars.tari.gov.tw/handle/123456789/20632
Title: 臺灣高粱苗枯病之病害環
Authors: 王文杰
孫守恭
Issue Date: Dec-1981
Publisher: 植物保護學會
Journal Volume: 23
Journal Issue: 4
Start page/Pages: 275-275
Source: 植物保護學會會刊 
Abstract: 
苗枯病(Seedling blight)在高粱幼苗期發生最為嚴重,造成心葉枯死的病徵;成長期田間亦可發現心葉枯死之植株。濕度大時,於枯死之心葉及受害穗部可見白色菌絲及分生胞子;收穫後殘桿莖基部有藍黑色小點生出,此乃子囊殼。以PCNB選擇性培養基收集空中胞子發現白天及夜間的胞子數沒有差異,而於花藥飄落時收集之胞子數達最高峯。
URI: https://scholars.tari.gov.tw/handle/123456789/20632
ISSN: 0577-750X
Appears in Collections:(4)植物病理組

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